FEATURES

• Ultra low-profile for excellent compatibility with larger components

• Cost-efficient next-gen performance for designers and video editing applications

• Carefully selected superior quality ICs, without mixing memory IDM, to guarantee exceptional performance and reliability

• Sliver aluminum heatsinks are made for maximum cooling

• Supports Intel® XMP (Extreme Memory Profile) 3.0 & AMD EXPO™ for one-click overclocking

• On-die ECC and PMIC for long-term data reliability, stability, and efficient power supply

• QVL approved and compatible with mainstream motherboards